CEA-Léti, the Laboratory for Electronics & Information Technology is operated by Direction de la Recherche Technologique at CEA, the French Atomic Energy Commission. It mainly aims at helping companies to increase their competitiveness through technological innovation and transfer of its technical know-how to industry. Major player in the MINATEC Micro-Nano technologies innovation center, CEA-Léti benefits from 10000 m2 state-of-the- art clean rooms, with equipment worth some 160 million euros. It is currently employing some 1400 people among whom 1000 CEA employees and co-workers of various status including 100 people from industrial partners, working in the CEA-Léti premises within the framework of bilateral collaborations. The Department for Heterogeneous Integration on Silicon (DIHS), 159 Léti people, which covers the whole MEMS/NEMS technologies at Léti (in terms of SOI substrates, MEMS design, manufacturing, integration and packaging, and characterization / reliability), has a wide portfolio in the MEMS fields where it has many decades of experience. It utilizes on a daily basis the technical facilities of the Front-end (CMOS and NEMS) 200mm line and the back-end (MEMS) 200mm line, located in MINATEC premises and operated by another Léti Department. CEA-Léti also includes a Department for Design and System integration (DCIS).

Tasks in the project
CEA will mainly concentrate on the technological NEMS manufacturing in its front-end 200 mm line. It will take in charge the development of NEMS structures like silicon nanowires and nanoSG-FET, their integration with CMOS devices, the 0-level packaging, and will provide the realization of the different devices of the project (WP5). CEA will also actively participate in the NEMS designs for the silicon-wire sensor (WP1) and will orient the design of the SGFET-NEMS transistor by technological compatibility issues (WP2).

Experience
CEA–Léti was the first to introduce and to patent comb-like and thick SOI structures for the fabrication of MEMS like accelerometers which became also a standard. Many MEMS technologies have been transferred to industrial partners including both large companies like STM, Freescale, Thales and SME companies like TRONICs, SERCEL. More recently, an important focus on NEMS technologies and devices has been engaged for 4 years. It has started with the European projects MIMOSA, and MINAMI on thin SOI technology. An SON (Silicon On Nothing) technology has also been developed for NEMS, in the frame of a bilateral project with ST Microelectronics. These two approaches are now validated (few publications are still done by CEA-LETI on that subjects).

Senior staff
- Philippe Robert received a M.Sc. degree in optical electronic in 91 from the university of Grenoble, and a Ph.D in electrical engineering in 96, from the National Polytechnic Institute of Grenoble (INPG) for a research study about an electrostatic ultrasonic silicon micro-motor. From 1996 to 1998, he worked as R&D engineer at SILMAG S.A, to develop a new type of through wafer electrical interconnections for hard disk magnetic silicon heads. From 1998 to 2001, he was part of the technical staff of THALES-AVIONICS Sensor Unit, where he was in charge of silicon and quartz inertial sensors developments. In 2001, he joined CEA-LETI where he was involved in several projects on RF-MEMS. He is presently manager of the Microsystem Components Laboratory. He has published around 15 articles and more than 35 patents dealing with MEMS, NEMS and packaging.
- Eric Ollier was born in 1968. He received the degree of Physical Engineer and Ph.D. degree in "Optics, Optoelectronics and Microwaves", both from the National Polytechnic Institute of Grenoble (INPG), France, in 1991 and 1995 respectively. During his Ph.D. period, he worked at CEA-LETI and developed an optical micro- switch for optical telecommunications. At the end of the Ph.D (1995), he joined the Microtechnologies Department at CEA-LETI and from 1995 to 2001, he has undertaken research in MOEMS (opto-mechanical switches, optical cross-connect matrix, vibration sensor, scanners) and Integrated Optics (power splitters, collective and passive alignment). In 2002, he started R&D activities dealing with MEMS-CMOS integration and inertial sensors. He is now in charge of projects dealing with NEMS devices, MOSFET detection and NEMS-CMOS integration. He has authored or co-authored about 30 journal papers and conference contributions, and he holds 9 patents.